Sr Packaging Engineer I Job Description Template
Our company is looking for a Sr Packaging Engineer I to join our team.
Responsibilities:
- Design BGA packages for high frequency integrated circuits using Allegro Package Designer using SIP Layout;
- IR Drop and PDN optimization in packages/interposers. Recommend caps on packages;
- Recommend package layer stack-up, material, impedance targets and net assignments for signals;
- Document design guidelines for package designs;
- Develop package designs for signals exceeding 100Ghz GHz using RF transmission lines;
- Complete transient channel simulation using Keysight ADS, HSPICE;
- Complete package designs and parasitic extractions for Rambus products and IP Phys;
- Optimize and implement routing for high-speed signals and power planes;
- Complete system level PDN analysis using Keysight ADS, HSPICE;
- Complete package extractions (signal and power) using Cadence tools (PowerSI) and Ansys tools (Electronics Desktop, HFSS, SiWave);
- Proactively work on documentation in the form of user guide and integration guide to address customer integration questions;
- Complete system level PDN analysis and recommend decoupling strategies;
- Optimize single-ended/differential insertion loss, return loss, cross-talk for signals and high speed buses.
Requirements:
- Have the ability to work well within a team environment;
- Technically creative and results-oriented with the ability to manage multiple tasks;
- Experience with IC package/interposer design tools such as Cadence APD or SiP;
- High degree of self-motivation and personal responsibility;
- Knowledge of high speed bump compliance including DDR3/DDR4/GDDR6. LPDDR4, PCIE3/4, 10GKR, 28G Ethernet, 56G PAM4. 112G PAM4;
- Strong interpersonal, written and verbal skills to work with vendors and internal customers (design teams) and external customers;
- Strong background in Electromagnetics and Transmission Line principles;
- Strong understanding of package substrate manufacturing design rules and materials;
- Bachelor’s and/or Master’s Degree in Electrical and/or Electronic Engineering, Computer Engineering or Physics;
- Proficient in 2D/3D with modelling tools such as Cadence Sigrity, Ansoft HFSS/Q3D, Keysight ADS;
- 5+ years relevant experience in high speed package design and signal integrity.