Quantum Hardware Packaging Engineer

Apply advanced device integration and sample preparation skills as a Packaging Engineer supporting quantum hardware development in Toronto. Work with die bonding equipment and laboratory processes.Within Xanadu’s Hardware group, this Packaging Engineer supports the Packaging Team and works under senior engineer guidance. You will contribute to rack-scale quantum computer development through high-precision die bonding, sample builds, photonic assemblies, and micro-electronic assemblies.Key Responsibilities:
Operate high-precision die bonding processes and equipmentOptimize and improve die bonding processesMaintain the laboratory dailyExecute assigned sample buildsSupport photonic and micro-electronic assembliesRequirements:
BSc or higher in Engineering, Science, or related fieldsTwo-plus years in laboratory or cleanroom environmentsBasic semiconductor packaging process understandingExperience with epoxy and flip-chip die bondingBasic microscope techniques and technical writing skillsBring hands-on packaging expertise, die bonding experience, and laboratory discipline to Xanadu’s Toronto quantum hardware team.
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