Senior Asic Physical Design Lead For Soc Tapeouts
QUALCOMM, Inc.
Qualcomm Canada ULC is seeking a senior ASIC Physical Design engineer to lead end‑to‑end PD flows for SoCs and retimers. You will collaborate with front‑end, analog/SerDes, DFT, and packaging teams to drive tapeouts and ensure design convergence.The role requires strong experience with CTS, DRC/LVS, and access to Cadence Innovus or Synopsys ICC2, plus scripting in Python or Tcl to automate flows.
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Vacancy posted 1 hour ago
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