Hardware Engineer
NUVACORE
Nuvacore is building a ground-up high performance, low-power CPU for next-generation compute workloads. We are seeking a highly skilled and motivated Hardware Board Design Engineer to drive the architecture, design, and development of next-generation, high-performance, and energy-efficient CPU server solutions for data center applications. In this role, you will be responsible for the end-to-end hardware development life cycle, from initial concept and feasibility studies to schematic capture, PCB layout oversight, component selection, and laboratory brings-up. You will collaborate closely with cross-functional teams—including Package Design, Signal/Power Integrity (SI/PI), Thermal/Mechanical Engineering, and Software/Firmware—to deliver robust, scalable, and cutting-edge system platform hardware.ROLE
Board-Level Architecture & Design: Lead the design and development of complex, multi-layer, high-density interconnect (HDI) server motherboards, baseboards, and riser cards optimized for data center workloadsSchematic Capture & Component Selection: Ownership of schematic entry, creation of complex hierarchical designs, and rigorous component selection prioritizing power efficiency, thermal performance, and long-term reliabilityLayout Collaboration: Work hand-in-hand with PCB layout engineers to define board stack-ups, routing constraints, component placement, and shielding strategiesCross-Functional Alignment: Collaborate tightly with the Silicon, Package Design, and SI/PI teams to implement optimal co-design methodologies for high-speed interfaces (e.G., PCIe Gen6/Gen7, DDR5/LPDDR6, CXL) and robust power delivery networks (PDN)Power & Thermal Management: Design highly efficient, high-current power delivery paths (VRMs, multiphase buck converters) capable of supporting ultra-high-power CPUs while meeting strict data center energy-efficiency metricsBring-up, Validation, & Debug: Lead the hands-on hardware bring-up, debugging, and validation of prototype boards in the lab using high-speed oscilloscopes, logic analyzers, and specialized test equipmentManufacturing Support: Generate comprehensive fabrication and assembly documentation (Gerbers, BOMs, ODB++). Partner with fabrication houses and EMS partners to resolve DFM/DFA/DFT issues and ensure smooth mass production transitionsRequirements — Must Have
Education: Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related technical fieldExperience: 5+ years of professional experience in high-speed hardware board design, ideally focused on enterprise servers, data center hardware, or complex computing platformsEDA Tools: High proficiency in industry-standard schematic capture and PCB layout tools (e.G., Cadence Allegro, Concept HDL, OrCAD, or Altium Designer)High-Speed Design Knowledge: Direct experience designing with high-speed serial/parallel interfaces (such as PCIe, DDR/LPDDR, or USB) and understanding basic SI/PI constraintsPower Delivery: Proven experience with board-level power distribution design, DC-DC converters, and multi-phase VRMs supporting high-current railsLab Skills: Strong hands-on laboratory experience with hardware debugging, rework, and using diagnostic equipment (DMMs, scopes, network analyzers)Requirements — Nice To Have
Education: Master’s degree in Electrical Engineering or Computer EngineeringAdvanced Data Center Experience: 10+ years deep understanding of data center server architectures, OCP (Open Compute Project) standards, and system topologies (e.G., CPU sockets, high-speed riser configurations, and BMC sub-systems)Silicon-Package-Board Co-Design: Familiarity with the interplay between advanced semiconductor packaging (e.G., chiplets, 2.5D bridges) and high-density PCB implementationSimulation & Modeling: Familiarity with SI/PI and thermal simulation concepts using tools such as Ansys (SIwave, HFSS), Cadence Sigrity, or HyperLynx to guide early-stage design constraintsManufacturing Integration: Strong background in optimizing layouts for high-volume manufacturing, minimizing layer counts while maintaining performance, and handling DFX (Design for Manufacturing/Assembly/Test) validationSelf-Driven & Collaborative: Excellent communication and cross-functional collaboration skills, with the ability to thrive in a fast-paced, startup-like environmentWe may use artificial intelligence (AI) tools to support parts of the hiring process, such as reviewing applications, analyzing resumes, or assessing responses and identifying potential inconsistencies or verification signals in application materials based on available information. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.
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Board-Level Architecture & Design: Lead the design and development of complex, multi-layer, high-density interconnect (HDI) server motherboards, baseboards, and riser cards optimized for data center workloadsSchematic Capture & Component Selection: Ownership of schematic entry, creation of complex hierarchical designs, and rigorous component selection prioritizing power efficiency, thermal performance, and long-term reliabilityLayout Collaboration: Work hand-in-hand with PCB layout engineers to define board stack-ups, routing constraints, component placement, and shielding strategiesCross-Functional Alignment: Collaborate tightly with the Silicon, Package Design, and SI/PI teams to implement optimal co-design methodologies for high-speed interfaces (e.G., PCIe Gen6/Gen7, DDR5/LPDDR6, CXL) and robust power delivery networks (PDN)Power & Thermal Management: Design highly efficient, high-current power delivery paths (VRMs, multiphase buck converters) capable of supporting ultra-high-power CPUs while meeting strict data center energy-efficiency metricsBring-up, Validation, & Debug: Lead the hands-on hardware bring-up, debugging, and validation of prototype boards in the lab using high-speed oscilloscopes, logic analyzers, and specialized test equipmentManufacturing Support: Generate comprehensive fabrication and assembly documentation (Gerbers, BOMs, ODB++). Partner with fabrication houses and EMS partners to resolve DFM/DFA/DFT issues and ensure smooth mass production transitionsRequirements — Must Have
Education: Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related technical fieldExperience: 5+ years of professional experience in high-speed hardware board design, ideally focused on enterprise servers, data center hardware, or complex computing platformsEDA Tools: High proficiency in industry-standard schematic capture and PCB layout tools (e.G., Cadence Allegro, Concept HDL, OrCAD, or Altium Designer)High-Speed Design Knowledge: Direct experience designing with high-speed serial/parallel interfaces (such as PCIe, DDR/LPDDR, or USB) and understanding basic SI/PI constraintsPower Delivery: Proven experience with board-level power distribution design, DC-DC converters, and multi-phase VRMs supporting high-current railsLab Skills: Strong hands-on laboratory experience with hardware debugging, rework, and using diagnostic equipment (DMMs, scopes, network analyzers)Requirements — Nice To Have
Education: Master’s degree in Electrical Engineering or Computer EngineeringAdvanced Data Center Experience: 10+ years deep understanding of data center server architectures, OCP (Open Compute Project) standards, and system topologies (e.G., CPU sockets, high-speed riser configurations, and BMC sub-systems)Silicon-Package-Board Co-Design: Familiarity with the interplay between advanced semiconductor packaging (e.G., chiplets, 2.5D bridges) and high-density PCB implementationSimulation & Modeling: Familiarity with SI/PI and thermal simulation concepts using tools such as Ansys (SIwave, HFSS), Cadence Sigrity, or HyperLynx to guide early-stage design constraintsManufacturing Integration: Strong background in optimizing layouts for high-volume manufacturing, minimizing layer counts while maintaining performance, and handling DFX (Design for Manufacturing/Assembly/Test) validationSelf-Driven & Collaborative: Excellent communication and cross-functional collaboration skills, with the ability to thrive in a fast-paced, startup-like environmentWe may use artificial intelligence (AI) tools to support parts of the hiring process, such as reviewing applications, analyzing resumes, or assessing responses and identifying potential inconsistencies or verification signals in application materials based on available information. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.
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