Asic Physical Design Engineering Intern
QUALCOMM, Inc.
ASIC physical design and scripting define this Qualcomm internship in Markham, Canada, supporting synthesis analysis and backend flow work.As an Intern on Qualcomm’s QDSP team, you will contribute to ASIC physical design implementation tasks. You will work with current ASIC technologies, EDA tools, and flow methodology development. TCL, Perl, and Python scripting support these engineering activities.Key Responsibilities:
Analyze synthesis and backend flows for ASIC implementationSupport physical design implementation related tasksDevelop flow methodologies using scripting languagesWork with current ASIC technologies and EDA toolsContribute to Qualcomm QDSP team engineering activitiesRequirements:
Study toward a bachelor’s or master’s degreeElectrical Engineering, Computer Engineering, or related fieldExperience with TCL, Perl, and PythonVLSI academic or project experience is desirableAt least one year programming experience academicallyBuild ASIC physical design experience with Qualcomm through synthesis analysis, backend flows, EDA tools, and scripting.
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Analyze synthesis and backend flows for ASIC implementationSupport physical design implementation related tasksDevelop flow methodologies using scripting languagesWork with current ASIC technologies and EDA toolsContribute to Qualcomm QDSP team engineering activitiesRequirements:
Study toward a bachelor’s or master’s degreeElectrical Engineering, Computer Engineering, or related fieldExperience with TCL, Perl, and PythonVLSI academic or project experience is desirableAt least one year programming experience academicallyBuild ASIC physical design experience with Qualcomm through synthesis analysis, backend flows, EDA tools, and scripting.
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Vacancy posted 1 hour ago
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