Analog Validation & Characterization Engineer

HaiLa is building ultra-low power radio communications solutions that will eliminate the need for batteries in wireless communication devices by offering a product that is hyper power efficient that can run indefinitely from harvested energy. Our missionis to enable Ambient Power IoT with sensing everywhere on existing protocols such as Wi‑Fi.

This is an exciting opportunity for an Analog Validation & Characterization Engineer to join our dynamic and diverse team! In this full‑time role reporting to the VP of Engineering, you will lead the electrical validation, characterization, and production test development for our analog and mixed‑signal integrated circuits.

Based in Montreal, HaiLa is supported by leading sustainability‑focused venture investors as well as Stanford University.

Description

HaiLa’s Engineers develop the next‑generation wireless technologies dedicated to unlocking the vast potential of the Internet of Things. HaiLa’s chipsets focus on ultra‑low power Wi‑Fi backscatter connectivity.

As an Analog Validation & Characterization Engineer, you will own the path from first silicon bring‑up through high‑volume production test, working closely with design, packaging, and product engineering teams to ensure our chips meet performance specifications across the full range of real‑world operating conditions.

This is a hands‑on role for someone who is equally comfortable on the lab bench with probes and precision instrumentation as they are writing automated test programs for a production ATE platform.

Responsibilities:

• Plan and execute lab‑bench validation of new silicon, including bring‑up, debug, and functional/performance verification against block‑level and full‑chip specifications.
• Perform chip‑to‑chip and lot‑to‑lot performance characterization, comparing measured results against expected design targets and datasheet specifications, and produce clear, data‑driven reports for design and product teams.
• Design and run systematic characterization studies across Process, Voltage, and Temperature (PVT) corners to establish guardbands, yield risk, and margin to specification.
• Operate and maintain lab‑bench equipment (network analyzers, spectrum analyzers, protocol analyzers, signal/pattern generators, oscilloscopes, power supplies, precision DMMs, temperature‑controlled chambers, etc.) and probe‑based test setups (manual and semi‑automated wafer probe stations, RF/DC probing).
• Collaborate with the PCB design/layout team to define and review test board and load board designs, ensuring signal integrity, calibration accuracy, and de‑embedding suitable for high‑precision analog/RF measurements.
• Partner with design engineers to correlate bench, probe, and production test data against simulation, and translate findings into design or test program improvements.
• Document test procedures, characterization results, and specification compliance for internal design reviews and customer‑facing datasheets.
• BS/MS in Electrical Engineering or a related field, with 5+ years of experience in analog/RF/mixed‑signal IC test, validation, or characterization.
• Demonstrated experience with lab‑bench test equipment and instrumentation for analog/RF measurements.
• Hands‑on experience with wafer probe test equipment and probing techniques (manual or automated).
• Proven track record of characterizing chip‑to‑chip performance and reporting results against block‑level specifications and full‑chip performance targets.
• Experience developing automated test programs for foundry wafer probe and/or OSAT final test.
• Demonstrated experience designing and executing systematic PVT characterization plans.
• Solid understanding of PCB test board/load board design and layout practices for high‑frequency and precision analog signals (grounding, decoupling, controlled impedance, shielding).
• Working knowledge of CMOS analog/mixed‑signal design principles sufficient to interpret schematics, specifications, and simulation data.
• General understanding of CMOS packaging and bonding processes (wire bond, flip‑chip, WLCSP, etc.) and their impact on electrical performance.
• Strong data analysis skills (statistical analysis, correlation, outlier detection) and proficiency with tools such as Python and MATLAB.
• Excellent written and verbal communication skills, with the ability to present characterization findings clearly to cross‑functional teams.
• On‑site presence in our Ottawa office is required.

Preferred qualifications:

• Experience with RF characterization (S‑parameters, noise figure, gain/linearity, matching networks) in addition to analog/mixed‑signal test.
• Familiarity with test program languages/environments for Teradyne or equivalent platforms (e.g., IG‑XL).
• Experience supporting new product introduction (NPI) from first silicon through production ramp.
• Familiarity with reliability test methods (HTOL, burn‑in, ESD/latch‑up characterization).
• Experience working directly with foundries and OSATs on test insertion planning and yield improvement.

Why work for HaiLa

• Play a key role in bringing the breakthrough power‑efficient technology to market.
• Be part of a solution that aims to remove hundreds of millions of batteries from landfills.
• Work with a lean and agile team of the best hardware and software engineers in the industry who are eager to share their expertise.
• Gain work experience with an innovative high‑tech start‑up with a future‑proof vision.
• Take new analog/RF silicon from first bring‑up through high‑volume production test
• Work hands‑on across the lab bench, wafer probe, and production ATE in a single role
• Generate the characterization data that drives design decisions and customer‑facing datasheets
• Work in a driven, fast‑paced startup environment and help build the validation foundation from the ground up...