Staff Engineer, Physical Design/Implementation
$124.2k - $174.2k per yearQUALCOMM, Inc.
CompanyQualcomm Canada ULC
Job AreaEngineering Group, Engineering Group >
ASICS Engineering
General SummaryAs a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next‑generation experiences and drives communication and data processing transformation to help create a smarter, connected future for all.
Replacement PositionWhat You'll Do
Lead and execute end‑to‑end Physical Design flow for SoC and retimer ASICs, including:
Floorplanning
Clock Tree Synthesis (CTS)
Placement & Routing
Power Delivery Network (PDN)
Timing analysis and closure
Plan and implement full‑chip or hierarchical designs, including full‑reticle‑scale integration
Drive timing closure across all corners and modes (MMMC), including SI‑aware optimization
Perform and review physical verification checks:
DRC, LVS
Design‑for‑manufacturability (DFM)
Design‑for‑yield (DFY)
Collaborate with cross‑functional engineering teams (front‑end, analog/SerDes, DFT, packaging, silicon validation) to ensure design convergence and tapeout readiness
Lead integration of high‑speed SerDes macros and mixed‑signal IP, ensuring robust floorplan and signal integrity alignment
Drive IR/EM closure, power optimization, and congestion mitigation for large die designs
Provide schedules, risk assessment, and execution tracking to drive successful silicon tapeouts
Act as a strong technical contributor in design reviews and project meetings, influencing architecture and implementation decisions
Develop and improve physical design methodologies and flows to enhance efficiency and scalability
What You'll Need
Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field and 3+ years of experience, OR Bachelor's degree and 4+ years of progressive experience in ASIC Physical Design or related domain
Strong experience with:
End‑to‑end ASIC Physical Design flow
Timing closure and signoff methodologies
Physical verification flows
Hands‑on expertise in industry‑standard EDA tools (e.G., Cadence Innovus / Synopsys ICC2)
Solid understanding of:
Power delivery and reliability (IR/EM)
Clocking architectures and CTS
Large‑scale SoC integration challenges
Preferred Qualifications
Experience with high‑speed SerDes / retimer designs (PAM4‑class signaling)
Experience with full‑reticle or near‑reticle SoC implementation
Familiarity with multi‑die / chiplet / advanced packaging architectures
Exposure to data center, networking, or optical connectivity ASICs
Strong scripting and automation skills (Python, Tcl)
Key Competencies
Proven ability to lead complex PD execution in high‑pressure tapeout environments
Strong analytical and problem‑solving skills with attention to detail
Ability to synthesize ambiguous or conflicting requirements into execution plans
Effective collaboration across global, cross‑functional engineering teams
Minimum Qualifications
Bachelor's degree in Science, Engineering, or related field and 4+ years of ASIC design, verification, validation, integration, or related work experience.
Master's degree in Science, Engineering, or related field and 3+ years of ASIC design, verification, validation, integration, or related work experience.
PhD in Science, Engineering, or related field and 2+ years of ASIC design, verification, validation, integration, or related work experience.
ApplicantsQualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability‑View email address on ca.hrm.tc or call Qualcomm's toll‑free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay Range And Other Compensation & Benefits$124,200.00 - $174,200.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales‑incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer.
If you would like more information about this role, please contact Qualcomm Careers.
#J-18808-Ljbffr
Job AreaEngineering Group, Engineering Group >
ASICS Engineering
General SummaryAs a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next‑generation experiences and drives communication and data processing transformation to help create a smarter, connected future for all.
Replacement PositionWhat You'll Do
Lead and execute end‑to‑end Physical Design flow for SoC and retimer ASICs, including:
Floorplanning
Clock Tree Synthesis (CTS)
Placement & Routing
Power Delivery Network (PDN)
Timing analysis and closure
Plan and implement full‑chip or hierarchical designs, including full‑reticle‑scale integration
Drive timing closure across all corners and modes (MMMC), including SI‑aware optimization
Perform and review physical verification checks:
DRC, LVS
Design‑for‑manufacturability (DFM)
Design‑for‑yield (DFY)
Collaborate with cross‑functional engineering teams (front‑end, analog/SerDes, DFT, packaging, silicon validation) to ensure design convergence and tapeout readiness
Lead integration of high‑speed SerDes macros and mixed‑signal IP, ensuring robust floorplan and signal integrity alignment
Drive IR/EM closure, power optimization, and congestion mitigation for large die designs
Provide schedules, risk assessment, and execution tracking to drive successful silicon tapeouts
Act as a strong technical contributor in design reviews and project meetings, influencing architecture and implementation decisions
Develop and improve physical design methodologies and flows to enhance efficiency and scalability
What You'll Need
Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field and 3+ years of experience, OR Bachelor's degree and 4+ years of progressive experience in ASIC Physical Design or related domain
Strong experience with:
End‑to‑end ASIC Physical Design flow
Timing closure and signoff methodologies
Physical verification flows
Hands‑on expertise in industry‑standard EDA tools (e.G., Cadence Innovus / Synopsys ICC2)
Solid understanding of:
Power delivery and reliability (IR/EM)
Clocking architectures and CTS
Large‑scale SoC integration challenges
Preferred Qualifications
Experience with high‑speed SerDes / retimer designs (PAM4‑class signaling)
Experience with full‑reticle or near‑reticle SoC implementation
Familiarity with multi‑die / chiplet / advanced packaging architectures
Exposure to data center, networking, or optical connectivity ASICs
Strong scripting and automation skills (Python, Tcl)
Key Competencies
Proven ability to lead complex PD execution in high‑pressure tapeout environments
Strong analytical and problem‑solving skills with attention to detail
Ability to synthesize ambiguous or conflicting requirements into execution plans
Effective collaboration across global, cross‑functional engineering teams
Minimum Qualifications
Bachelor's degree in Science, Engineering, or related field and 4+ years of ASIC design, verification, validation, integration, or related work experience.
Master's degree in Science, Engineering, or related field and 3+ years of ASIC design, verification, validation, integration, or related work experience.
PhD in Science, Engineering, or related field and 2+ years of ASIC design, verification, validation, integration, or related work experience.
ApplicantsQualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability‑View email address on ca.hrm.tc or call Qualcomm's toll‑free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay Range And Other Compensation & Benefits$124,200.00 - $174,200.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales‑incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer.
If you would like more information about this role, please contact Qualcomm Careers.
#J-18808-Ljbffr
Vacancy posted 1 hour ago
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