Optical Packaging & Assembly Engineer
$94.2k - $130k per yearJaide Health
Optical Packaging & Assembly Engineers at PhotonicOptical Packaging & Assembly Engineers at Photonic are part of a team to realize first-of-their-kind photonic all-integrated circuits for implementing truly scalable quantum technologies. You will be developing, implementing and testing robust and scalable packaging and assembly procedures for a variety of photonic circuits. As an Optical Packaging & Assembly Engineer, you are a specialist in optical alignment and assembly, process development, and NPI (New Product Introduction). You will work in a diverse, fast-paced, and multi-disciplinary team of engineers, scientists and technicians.
Department
Test Packaging Integration
Employment Type
Full Time
Location
British Columbia, Canada (Onsite)
Workplace type
Onsite
Compensation
CA$94,200 - CA$130,000 / year
ABOUT THE ROLE
Develop and implement optical packaging and assembly processes for integrated photonic devices, including high-precision active alignment to achieve optimal coupling efficiency and long-term stability
Design, validate, and optimize alignment methods and tooling to improve accuracy, throughput, and repeatability
Establish validation plans and characterize optical performance under relevant operating conditions
Define scalable workflows, SOPs, and process controls to ensure consistent manufacturing outcomes
Support New Product Introduction by partnering with design, device, test, and manufacturing teams to apply Design for Excellence methodologies like Design for Manufacturability, Design for Test, and Design for Reliability early in the development cycle.
Develop assembly stations integrating precision motion, optical metrology, and environmental control
Analyze assembly, process, and test data to identify yield drivers, root causes, failure mechanisms, and opportunities for improved throughput, repeatability, and stability.
Collaborate across teams to develop robust, manufacturable packaging solutions
Define qualification criteria and acceptance standards to support product release
ABOUT YOU
PhD or Master’s degree in physics, applied physics, packaging engineering, electrical engineering, or other relevant discipline
Knowledge of and hands-on-experience with integrated photonics and optics
3+ years of experience with photonic integrated circuit, semiconductor, optoelectronic, fiber optic, or related packaging design & qualification
Working experience in new product introduction
Excellent teamwork, interpersonal and written communication skills.
Good organization, problem solving skills.
Strong attention to detail
An exceptional candidate will bring:
Deep hands-on expertise in high-precision optical alignment and packaging for Photonic Integrated Circuits
Proven ability to translate research-grade photonic assemblies into robust, production-ready assembly processes
Strong experience in data-driven process optimization including analyzing large datasets to identify yield drivers, diagnose failure mechanisms, and improve process stability
Demonstrated contribution to New Product Introduction (NPI) and experience in Design for Excellence (DfX) methodologies with focus on Design for Manufacturability (DfM), Design for Test (DfT), and Design for Reliability (DfR)
WHY YOU SHOULD WORK WITH US
Work closely with some of the brightest innovators in quantum technologies to drive breakthroughs that redefine computing
Enjoy a fast-paced and fun environment where you can try new things while solving innovative challenges every day
Inclusive company culture that values collaboration
Regular social events and fun activities keep our global team connected
Competitive compensation package including base salary, stock options, and relocation assistance for global talent
Comprehensive benefits including extended health, dental, life, long term disability, an employee assistance program, parental leave top-ups, and a flexible spending account
The description above is what we think an ideal candidate would look like for this role. At Photonic, we understand that everyone has a different work and life journey. If you feel your experience is close to what we've described, but you might not meet all the requirements, please still apply! All roles listed are for current vacancies. While artificial intelligence (AI) tools may be used to assist in reviewing applicant profiles, they do not determine candidate outcomes. Our hiring decisions are made by people, not algorithms. We are committed to fostering, cultivating, and preserving a culture of equity, diversity, and inclusion. We embrace and encourage our employees’ differences, knowing that these very differences inspire innovation and build better teams. If there are any accommodations our team can make throughout our hiring process, please let us know.
About PhotonicPhotonic Inc. is a leading quantum technology company developing commercial-scale quantum computers and quantum networks to address some of the world’s most pressing challenges in materials science, drug discovery, climate change, and security. The company’s approach unlocks performance at scale through unmatched distributed quantum computing capabilities. Photonic’s high-connectivity Entanglement First™ architecture leverages a unique qubit modality—optically linked silicon spin qubits to enable powerful computation, efficient error correction, and seamless integration with existing data center and telecom environments. Headquartered in Vancouver, British Columbia, with operations in the United States and United Kingdom, Photonic’s team is advancing quantum technologies alongside leading investors, partners, and customers worldwide.
#J-18808-Ljbffr
Department
Test Packaging Integration
Employment Type
Full Time
Location
British Columbia, Canada (Onsite)
Workplace type
Onsite
Compensation
CA$94,200 - CA$130,000 / year
ABOUT THE ROLE
Develop and implement optical packaging and assembly processes for integrated photonic devices, including high-precision active alignment to achieve optimal coupling efficiency and long-term stability
Design, validate, and optimize alignment methods and tooling to improve accuracy, throughput, and repeatability
Establish validation plans and characterize optical performance under relevant operating conditions
Define scalable workflows, SOPs, and process controls to ensure consistent manufacturing outcomes
Support New Product Introduction by partnering with design, device, test, and manufacturing teams to apply Design for Excellence methodologies like Design for Manufacturability, Design for Test, and Design for Reliability early in the development cycle.
Develop assembly stations integrating precision motion, optical metrology, and environmental control
Analyze assembly, process, and test data to identify yield drivers, root causes, failure mechanisms, and opportunities for improved throughput, repeatability, and stability.
Collaborate across teams to develop robust, manufacturable packaging solutions
Define qualification criteria and acceptance standards to support product release
ABOUT YOU
PhD or Master’s degree in physics, applied physics, packaging engineering, electrical engineering, or other relevant discipline
Knowledge of and hands-on-experience with integrated photonics and optics
3+ years of experience with photonic integrated circuit, semiconductor, optoelectronic, fiber optic, or related packaging design & qualification
Working experience in new product introduction
Excellent teamwork, interpersonal and written communication skills.
Good organization, problem solving skills.
Strong attention to detail
An exceptional candidate will bring:
Deep hands-on expertise in high-precision optical alignment and packaging for Photonic Integrated Circuits
Proven ability to translate research-grade photonic assemblies into robust, production-ready assembly processes
Strong experience in data-driven process optimization including analyzing large datasets to identify yield drivers, diagnose failure mechanisms, and improve process stability
Demonstrated contribution to New Product Introduction (NPI) and experience in Design for Excellence (DfX) methodologies with focus on Design for Manufacturability (DfM), Design for Test (DfT), and Design for Reliability (DfR)
WHY YOU SHOULD WORK WITH US
Work closely with some of the brightest innovators in quantum technologies to drive breakthroughs that redefine computing
Enjoy a fast-paced and fun environment where you can try new things while solving innovative challenges every day
Inclusive company culture that values collaboration
Regular social events and fun activities keep our global team connected
Competitive compensation package including base salary, stock options, and relocation assistance for global talent
Comprehensive benefits including extended health, dental, life, long term disability, an employee assistance program, parental leave top-ups, and a flexible spending account
The description above is what we think an ideal candidate would look like for this role. At Photonic, we understand that everyone has a different work and life journey. If you feel your experience is close to what we've described, but you might not meet all the requirements, please still apply! All roles listed are for current vacancies. While artificial intelligence (AI) tools may be used to assist in reviewing applicant profiles, they do not determine candidate outcomes. Our hiring decisions are made by people, not algorithms. We are committed to fostering, cultivating, and preserving a culture of equity, diversity, and inclusion. We embrace and encourage our employees’ differences, knowing that these very differences inspire innovation and build better teams. If there are any accommodations our team can make throughout our hiring process, please let us know.
About PhotonicPhotonic Inc. is a leading quantum technology company developing commercial-scale quantum computers and quantum networks to address some of the world’s most pressing challenges in materials science, drug discovery, climate change, and security. The company’s approach unlocks performance at scale through unmatched distributed quantum computing capabilities. Photonic’s high-connectivity Entanglement First™ architecture leverages a unique qubit modality—optically linked silicon spin qubits to enable powerful computation, efficient error correction, and seamless integration with existing data center and telecom environments. Headquartered in Vancouver, British Columbia, with operations in the United States and United Kingdom, Photonic’s team is advancing quantum technologies alongside leading investors, partners, and customers worldwide.
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